Electronic Components Industry News

A full silicon-carbide design has been published for an 18.4kW three-phase input, 52V output power module for compute racks. This is the highest-volume class of compute power supply and also the most easily overlooked: industry discussion is almost entirely ab

A full silicon-carbide reference design has been published for a 110kW, 3RU power shelf for compute racks. A shelf aggregates several supply modules into one high-density unit, so the PFC, DC-DC and output stages all run at high current.

A 300kW all-SiC design has been published for a data-centre edge microgrid unit that switches between grid-tied and islanded operation without interrupting the load. The hard part is keeping the load alive through the transfer, which puts strict demands on swi

A full silicon-carbide design has been published for a 200kW grid-forming unit that combines solar, diesel and battery storage for off-grid villages, rated 380V/50Hz and specified for 45℃, 95% relative humidity and salt-fog environments.

The silicon-carbide industry is moving from component-level competition to system-level collaboration, as integrated device manufacturers and driver-chip suppliers work together across the whole chain.

Official data shows that new growth drivers continue to play a leading role in China's manufacturing sector, with high-technology and equipment manufacturing growing faster than the overall industry.

A board manufacturer has walked through the specific design and process difficulties in small home energy-storage products, where cost pressure is high and the electrical environment is unforgiving.

Huawei's Ascend 960 AI chip is reported to be launching earlier than originally planned, adding momentum to the domestic AI compute supply chain.

A technical article examines the second bond, or fish-tail bond, in semiconductor wire bonding and the process parameters that determine its quality.

A team has built an edge-AI solution that grades durian ripeness on-device, avoiding the latency and connectivity problems of cloud inference.

Halomicro has released seven DC motor driver ICs aimed at a range of core applications, from portable devices to industrial equipment.

Domestic authentication chips are being adopted in wireless charging to verify that the transmitter and receiver are a matched, safe pair.

elexcon 2026 focused on how the AI supercycle is reshaping China's semiconductor industry, from design wins to packaging and supply.

Penggean's TS-PON technology delivers more than 25Gbps of bandwidth with microsecond-level latency over a single optical fibre, targeting autonomous driving and robotics.

A survey article maps the AI chip landscape from ten-thousand-GPU training clusters down to milliwatt edge terminals.

The economics of LLM inference per token are pushing AI systems toward more sophisticated storage tiering, balancing cost, bandwidth and latency.

AOS has presented SiC and silicon solutions for the intermediate bus converter stage in AI server power architectures using high-voltage DC distribution.

Nordic Semiconductor has expanded its nRF54L series with new multi-protocol systems-on-chip aimed at cost-effective IoT devices.

Tektronix has introduced a regenerative dynamic test system aimed at 800V power systems in AI data centres.

Quectel says bringing AI capability to the edge across its product lines opens a new growth curve for AIoT.

A supply-chain review of alloy current-sense resistors shows AI compute creating a small but demanding niche for precision parts.

Rohde & Schwarz has described using its radio communication test set together with VSE software to analyse IQ modulated signals.

INFAC has adopted Vicor high-density power conversion technology to implement a 48V automotive zonal architecture.

Halomicro has released three stepper motor driver ICs focused on precise control while keeping heat under control.

China and Malaysia are extending their digital economy cooperation from trade and project matchmaking into technology collaboration, industrial applications and talent development.

MIIT and the NDRC have jointly issued the 15th Five-Year Plan for the electronics manufacturing industry, setting development targets out to 2030 with an industry-scale goal of RMB 30 trillion.

A student competition team has built a quadrotor drone on an RK3588 and ELF2 development board, combining autonomous flight, obstacle avoidance, gas detection and real-time data visualisation.

As battery energy storage systems move to higher voltage architectures, insulation monitoring has shifted from a compliance checkbox to a core safety function. Systems can run at 1,000 to 1,500VDC or above, and reed relays are used in the insulation detection

Rapidus president Atsuyoshi Koike has floated the idea of building a semiconductor fab on the Moon around 2040, with IBM providing technical support.

At the 2026 China Computing Conference in Langfang, it was announced that the national computing platform is connecting platforms across all 31 provincial-level regions, forming an integrated monitoring and scheduling network.

Mouser has begun stocking Infineon's XENSIV TLE4978 high-bandwidth current sensor, designed for next-generation power conversion systems with low noise, high bandwidth and high accuracy.

Renesas has described the architecture and deployment models of its RealityAI offering, covering the path from data processing to model deployment.

This walkthrough demonstrates running an electronic image stabilisation (DIS) pipeline on an EASY-EAI-Nano-TB board with MIPI-CSI cameras, including the wiring diagram.

Rising memory prices combined with US export controls on HBM have left Chinese AI chip makers squeezed on both cost and supply, with reports of significant price increases.

This walkthrough demonstrates panoramic stitching (AVS) on an EASY-EAI-Nano-TB board using two MIPI-CSI cameras, comparing blended and non-blended output.

The first 2026 AI Productivity Conference was held in Wuhan's Optics Valley, organised by industry companies and associations, with more than 700 experts, industry representatives and ecosystem partners attending.

Traditional crafts are reaching much wider audiences. Industry data puts the sector at roughly 25,000 enterprises above a designated size, close to 3.5 million practitioners and a substantial annual revenue base.

At a press conference on the "AI + Software" action plan, MIIT proposed driving deep integration of EDA and other general-purpose industrial software with AI, exploring next-generation intelligent industrial software.

Zhu Min, vice president of the China Centre for Information Industry Development, described agent software as a new software form with autonomous perception, memory, decision-making, interaction and execution capabilities.

MIIT has said China will strengthen the construction and operation of open-source communities for humanoid robots, building an independently controllable full-stack technology and service capability.

Zhongwei Aixin has released the AiP4068 series single-cell Li-ion charger in ESOP8 and DFN8 packages, integrating trickle, constant-current and constant-voltage charging, C/10 termination, dual status LEDs, low-level CE enable and 28V withstand voltage.

As AI compute and humanoid robotics push power systems toward higher power, higher efficiency and smaller size, NOVOSENSE has introduced GaN driver ICs to address the driving challenges in high-power-density designs.

Apple has announced a 2nm phone chip with twice the AI processing capability of the previous generation, to be used in the iPhone Duo, iPhone 18 Pro and iPhone 18 Pro Max.

HPMicro has launched a T1 robot joint solution built on its HPM6E80 high-performance MCU, integrating motor control, encoder feedback, temperature sensing and EtherCAT communication — with EtherCAT running over only two wires.

The 2026 conference on integrating informatisation with industrialisation, and on digital transformation, opened in Ningbo with MIIT and municipal officials attending.

This practical guide extends an RK3506 data-acquisition chain from local ADC channels to RS485 bus devices, reading temperature and humidity sensors over Modbus RTU.

This article introduces the EASY-EAI-Nano-TB evaluation board using the DRM (Direct Rendering Manager) framework to let multiple applications share a single display.

The commercial interactive display market is changing. Digital signage and large-format terminals used to run AI in the cloud with the device only capturing and playing back; now AI avatars, fitness mirrors and body-composition kiosks require local NPU compute

Seven ministries and commissions have jointly issued a notice to collect typical cases in audiovisual systems for 2026, covering 11 fields with a focus on VR, AR and XR scenarios.

onsemi has published a design handbook for AC-coupled energy storage systems. Converters paired with storage systems are divided into DC-coupled and AC-coupled types, and the AC-coupled architecture is mature with flexible grid-connection control.

This article explains the responsibilities, dependencies and API naming conventions of BSP, HAL, middleware and RTOS layers in the Renesas RA Flexible Software Package.

When the divider resistor, ADC reference and resistance-temperature table have all been checked and the reading still creeps upward during continuous sampling, the cause is often the thermistor's own power dissipation rather than the algorithm.

Many people assume the 555 timer waits for the capacitor to charge fully. It does not — it waits for a threshold crossing. Inside the classic 555, three equal resistors set comparison thresholds at roughly one third and two thirds of the supply voltage, and th

In a power converter, input capacitors connect to the supply through cabling with parasitic inductance. On first insertion — a hot-swap event — that inductance causes input ringing that can approach twice the DC input voltage.

I2C uses just two wires — SDA for data and SCL for the clock — with start conditions, addressing, ACK and stop conditions completing a transfer. So why are pull-up resistors mandatory?

A power-type NTC thermistor is a semiconductor resistor whose resistance changes sharply with temperature — that is where the name comes from.