Chips & Semiconductors Elecfans · Kewei Technology industry research

A Detailed Look at the Second Bond (Fish-Tail) in Semiconductor Wire Bonding

A technical article examines the second bond, or fish-tail bond, in semiconductor wire bonding and the process parameters that determine its quality.

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A technical article examines the second bond, or fish-tail bond, in semiconductor wire bonding and the process parameters that determine its quality.

Second-bond defects are a classic source of intermittent failures that only appear after thermal cycling, so process control here directly affects outgoing quality.

For buyers of semiconductor devices, the takeaway is that packaging quality is worth asking about. Kewei Technology sources from original and authorized channels so that batch traceability can be verified.

Kewei's take: what this means for procurement

Progress like this usually means supply of the affected chips loosens gradually, though popular part numbers can stay tight in the short term. Build a list of your high-volume lines, compare prices regularly and order in batches.

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